GLOBECOM 2004 EXECUTIVE COMMITTEE

General Chair:
Rajiv Shah
Alcatel, USA
rajiv.shah@alcatel.com

Vice General Chair, Operations:
Harold Sobol
HMS Associates, USA
h.sobol@ieee.org

Vice General Chair, Planning and Telecom Business Forum:
Dhawal Moghe
Alcatel, USA
dhawal.moghe@alcatel.com

Vice General Chair, Exhibits, Patrons and Publicity:
Michael Kincaid
MSK Associates, USA
wf.kf@verizon.net

Technical Program Chair:
Theodore Rappaport
The University of Texas at Austin, USA
wireless@mail.utexas.edu

Vice Technical Program Chair:
Tom Chen
Southern Methodist University, USA
tchen@seas.smu.edu

Design & Development Forum Chair:
Saibun Tjuatja
The University of Texas at Arlington, USA
tjuatja@uta.edu

Tutorial and Workshop Chair
Andrea Goldsmith
Stanford University
andrea@ee.stanford.edu

Forum Vice Chair
Tom McDermott
Chiaro Networks

Technical Program Administration:
Jennifer Wright
The University of Texas at Austin, USA
jenn.wright@mail.utexas.edu

International Chair:
Y. Paul Chiang
MathStar Inc.
paul.chiang@mathstar.com

Finance Chair:
Peter Waal
Waal Associates, USA
pete@waalnet.com

Vice Chair Finance:
Randal Oberle
Raytheon, USA
r-oberle@raytheon.com

Technical Publications Chair:
Soontorn Oraintara
The University of Texas at Arlington, USA
oraintar@uta.edu

Registration Chair:
Merrily Hartmann
Retired, SBC Communications Inc.
merrily@swbell.net

Publicity Chair:
Brian Fraser
Metroplex Technology Business Council, USA
brian@telecomcorridor.com

Exhibits Chair:
Ron Ogan
Chair, Dallas Section IEEE, USA
rtogan@ieee.org

Student Volunteer Coordinator:
Dinesh Rajan
SMU, USA
rajand@engr.smu.edu

Executive Committee Secretary:
Murali Iyengar
Axes Technologies, Inc.
miyengar@axestech.com

Local Arrangements Chairs:
Jessica and Howard Taper
Taper Communications, USA
jessica@tapercom.com
howard.tapercom.com

IEEE Dallas Section Representative:
Bob Shapiro
Treasurer, Dallas Section IEEE, USA
rcshapiro@comcast.net

GICC Advisor:
Michael Kincaid
MSK Associates, USA
wf.kf@verizon.net

ComSoc Project Manager:
Debora Kingston
IEEE ComSoc, USA
d.kingston@comsoc.org


GLOBECOM 2004 TECHNICAL PROGRAM COMMITTEE
Technical Program Chair:
Theodore S. Rappaport
University of Texas at Austin, USA
wireless@mail.utexas.edu

Assistant:
Jennifer Wright
jenn.wright@mail.utexas.edu

Technical Program Vice Chair:
Tom Chen
Southern Methodist University, USA
tchen@seas.smu.edu

SYMPOSIUM CHAIRS
COMMUNICATION THEORY
Len Cimini
University of Delaware, USA
cimini@ece.udel.edu

Dennis L. Goeckel
Univ. of Mass
goeckel@chloe.ecs.umass.edu

Naofal Al-Dhahir
University of Texas at Dallas
naofal@research.att.com

Brian Hughes
North Carolina State University, USA
blhughes@eos.ncsu.edu

GENERAL CONFERENCE
Nelson Fonseca
Univ of Campinas, Brazil
nfonseca@ic.unicamp.br

Xiaodong Wang
Columbia Univ, USA
wangx@ee.columbia.edu

GLOBAL INTERNET & NEXT GENERATION NETWORKS
Arup Acharya
IBM Research, USA
arup@us.ibm.com

Yuguang Michael Fang
Univ. of Florida, USA
fang@ece.ufl.edu

G.S. Kuo
National Chengchi University, Taiwan
gskuo@ieee.org

OPTICAL COMMUNICATION NETWORKS & SYSTEMS
Andrea Fumagalli
Univ of Texas at Dallas, USA

Naoaki Yamanaka
NTT Network Innovation Laboratories, Japan
yamanaka.naoaki@lab.ntt.co.jp
SIGNAL PROCESSING FOR COMMUNICATIONS
Joseph Cavallaro
Rice University, USA
cavallar@rice.edu

Jaafar Elmirghani
University of Wales Swansea, United Kingdom
J.M.H.Elmirghani@swansea.ac.uk

Michael Zoltowski
Purdue Univ, USA
mikedz@ecn.purdue.edu

SECURITY AND NETWORK MANAGEMENT
Madjid Merabti
Liverpool John Moores University, United Kingdom
M.Merabti@livjm.ac.uk

Pradeep Ray
Univ of New South Wales, AUSTRIALIA
p.ray@unsw.edu.au

Gang Wu
DoCoMo USA Labs, USA
wu@docomolabs-usa.com

WIRELESS COMMUNICATION NETWORKS & SYSTEMS
K. B. Letaief
HKUST, Hong Kong
eekhaled@ee.ust.hk

Witold Krzymien
University of Alberta, Canada
wak@ee.ualberta.ca

C.K. Toh
Northrup Grumman, USA
ck.ieee@doctor.com

Boon Sain Yeo
Institute for Infocomm Research, Singapore
boonyeo@ieee.org

TECHNICAL PROGRAM COMMITTEE
Behnaam Aazhang,
Rice University, USA
Arup Acharyas,
IBM Research, USA

Arzad Alam,
Tata Institute of Fundamental Research, India

Naofal Al-Dhahir,
University of Texas at Dallas

Jeff Andrews,
University of Texas at Austin, USA

Koichi Asatani,
Kogakuin University, Japan
Sergio Benedetto,
Politecnico di Torino, Italy
Rick Blum,
Lehigh University, USA

Joseph Cavallaro,
Rice University, USA

Nim K. Cheung,
Telcordia Technologies, USA

Marco Chiani,
University of Bologna, Italy

Keith Chugg,
University of Southern California, USA

Len Cimini,
University of Delaware, USA

Anand Dabak,
Texas Instruments, USA

Sajal Das,
University of Texas at Arlington, USA

Jaafar Elmirghani,
University of Wales Swansea, United Kingdom

Brian Evans,
University of Texas at Austin, USA

Joe Evans,
University of Kansas, USA

Yuguang Michael Fang,
University of Florida, USA

Nelson Fonseca,
University of Campinas , Brazil

Andrea Fumagalli,
University of Texas at Dallas, USA

Javier Garcia-Frias,
University of Delaware, USA

Costas N. Georghiades,
Texas A&M University, USA

Silvia Giordano,
SUPSI, Switzerland

Dennis L. Goeckel,
University of Massachusetts, USA

Andrea Goldsmith,
Stanford University, USA

Mounir Hamdi,
Hong Kong University of Science & Technology,
Hong Kong

Paul Hartmann,
RFSAW, USA

Robert Heath,
University of Texas at Austin, USA

Brian Hughes,
North Carolina State University, USA
Mohammad IIyas,
Florida Atlantic University, USA
Andrzej Jajszczyk,
AGH University of Technology, Poland

Rich Kobylinski,
SBC Corporation, USA

Witold Krzymien,
University of Alberta, Canada

B.V.K. Vijaya Kumar,
Carnegie Mellon University, USA
Deepa Kundur,
Texas A&M University, USA
G.S. Kuo,
National Chengchi University, Taiwan
K. B. Letaief,
HKUST, Hong Kong
Upamanyu Madhow,
University of Calif.Santa Barbara, USA
Madjid Merabti,
Liverpool John Moores University, United Kingdom
Scott Miller,
Texas A&M University, USA
Amitabh Mishra,
Virginia Tech, USA
Hussein Mouftah,
University of Ottawa, Canada
Stanley Moyer,
Telcordia Technologies, USA
Krishna Narayanan,
Texas A&M University, USA
Rohit Negi,
Carnegie Mellon University, USA

Carl Panasik,
Texas Instruments, USA
George Papen,
University of Illinois at Urbana-Champaign, USA
Jong-Tae Park,
Kyungbuk National University, Korea
Ted Rappaport,
University of Texas at Austin, USA
Pradeep Ray,
University of New South Wales, Australia
Eric S. Reifsnider,
Wireless Valley Communications, USA
Alicia Russell,
SBC Corporation, USA
Iwao Sasase,
Keio University, Japan
Sanjay Shakkottai,
University of Texas at Austin, USA
Gregory Silvus,
Seagate Technology, USA
Roger R. Skidmore,
Wireless Valley Communications, USA
Hal Sobol,
HMS Associates, USA
Rich Thompson,
University of Pittsburgh, USA
C.K. Toh,
Northrop Grumman, USA
Bill Tranter,
Virginia Tech, USA
Xiadong Wang,
Columbia University, USA
Jennifer Wright,
University of Texas at Austin, USA
Gang Wu,
DoCoMo USA Labs, USA
Naoaki Yamanaka,
NTT Network Innovation Laboratories, Japan
Boon Sain Yeo,
Institute for Infocomm Research,Singapore
Jeffrey Yiin,
Silicon Laboratories, USA
Ken Young,
Telcordia Technologies, USA
Michael Zoltowski,
Purdue University, USA